Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

Keyphrases

• Reliability Assessment 100%
• Simulation Approach 100%
• Interposer 100%
• Through Glass via 100%
• Glass Interposer 100%
• Thermocompression 100%
• Epoxy Molding Compound 100%
• Submodeling 100%
• Reliability Issues 33%
• Simulation Model 33%
• Assembly Process 33%
• Coefficient of Thermal Expansion 33%
• Convergence Analysis 33%
• Generation Mechanism 33%
• Finite Element 33%
• Element-by-element 33%
• Thermal Expansion Mismatch 33%
• Potential Risk 33%
• Thermal Loading 33%
• Curing Process 33%
• Molding Compound 33%
• Mechanical Response 33%
• Convergence Issues 33%
• Stress Generation 33%
• Stress Placement 33%
• Critical Stress 33%
• First Principal Stress 33%

Engineering

• Reliability Assessment 100%
• Interposer 100%
• Glass Interposer 100%
• Thermocompression 100%
• Sheet Molding Compounds 100%
• Simulation Model 33%
• Assembly Process 33%
• Coefficient of Thermal Expansion 33%
• Reliability Issue 33%
• Mechanical Response 33%
• Critical Stress 33%
• Outer Corner 33%
• Finite Element Analysis 33%