Redundant via insertion under timing constraints

Chi Wen Pan*, Yu-Min Lee

*此作品的通信作者

研究成果: Conference contribution同行評審

10 引文 斯高帕斯(Scopus)

摘要

Redundant via insertion is a useful technique to alleviate the yield loss and elevate the reliability of VLSI designs. While extra vias are inserted into the design, the electronic properties of designed circuit might be altered, and the circuit timing might be changed and needs to be efficiently re-analyzed. Therefore, a fast timing (incremental timing) analyzer is required to assistant the redundant via insertion procedure. This work develops an efficient redundant via insertion method under timing constraints. Firstly, an effectively incremental circuit timing analysis method is developed, and the redundant via insertion task is transformed into a mixed bipartite-conflict graph matching problem. Then, the insertion problem is solved by a timing-driven minimum weighted matching algorithm. The experimental results show that the developed algorithm can achieve 3.2% extra insertion rates over the method without considering timing effects, which all redundant vias would be removed if the timing of that net does not meet the timing requirements, in average. In addition, the developed incremental timing analysis mechanism can speed up the runtime of redundant via insertion procedure under timing constraints by over 34 times in average.

原文English
主出版物標題Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011
頁面627-633
頁數7
DOIs
出版狀態Published - 2011
事件12th International Symposium on Quality Electronic Design, ISQED 2011 - Santa Clara, CA, United States
持續時間: 14 3月 201116 3月 2011

出版系列

名字Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011

Conference

Conference12th International Symposium on Quality Electronic Design, ISQED 2011
國家/地區United States
城市Santa Clara, CA
期間14/03/1116/03/11

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