Reduction of nickel-silicided junction leakage by nitrogen ion implantation

Tien-Sheng Chao*, Liang Yao Lee

*此作品的通信作者

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

Nickel-silicided junctions with low leakage by using a nitrogen implantation process are demonstrated in this paper. This technique can significantly improve the leakage problem of Ni-silicided junction. Junctions formed by this method exhibit a very low leakage current density of about 1 × 10-9 A/cm2, which represents 2-4 times reduction compared to conventional counterparts.

原文American English
期刊Japanese Journal of Applied Physics, Part 2: Letters
41
發行號2 A
DOIs
出版狀態Published - 1 2月 2002

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