Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

Tai Min Chang, Fu Hsin Chen, Meng Yen Chen, Yew-Chuhg Wu

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds