Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

Tai Min Chang; Fu Hsin Chen; Meng Yen Chen; Yew-Chuhg Wu

doi:10.1149/2.0071509jss

Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

Tai Min Chang, Fu Hsin Chen, Meng Yen Chen, Yew-Chuhg Wu

材料科學與工程學系

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

摘要

High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.

原文	English
頁（從 - 到）	R140-R143
期刊	ECS Journal of Solid State Science and Technology
卷	4
發行號	9
DOIs	https://doi.org/10.1149/2.0071509jss
出版狀態	Published - 2015

存取文件

10.1149/2.0071509jss

其它文件與鏈接

Link to publication in Scopus

引用此

@article{9831d9aaf8464f51834ffc0576b642a8,

title = "Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder",

abstract = "High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.",

author = "Chang, {Tai Min} and Chen, {Fu Hsin} and Chen, {Meng Yen} and Yew-Chuhg Wu",

note = "Publisher Copyright: {\textcopyright} 2015 The Electrochemical Society.",

year = "2015",

doi = "10.1149/2.0071509jss",

language = "English",

volume = "4",

pages = "R140--R143",

journal = "ECS Journal of Solid State Science and Technology",

issn = "2162-8769",

publisher = "Electrochemical Society Inc.",

number = "9",

}

TY - JOUR

T1 - Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

AU - Chang, Tai Min

AU - Chen, Fu Hsin

AU - Chen, Meng Yen

AU - Wu, Yew-Chuhg

PY - 2015

Y1 - 2015

N2 - High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.

AB - High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.

UR - http://www.scopus.com/inward/record.url?scp=84941041982&partnerID=8YFLogxK

U2 - 10.1149/2.0071509jss

DO - 10.1149/2.0071509jss

M3 - Article

AN - SCOPUS:84941041982

SN - 2162-8769

VL - 4

SP - R140-R143

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

IS - 9

ER -

Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

摘要

存取文件

其它文件與鏈接

指紋

引用此