@inproceedings{5239d9765443460b9630fb73c0edc184,
title = "Reducing the overkills and retests in wafer testing process",
abstract = "Reducing overkills is one of the main objectives in the wafer testing process, however the major mean to prevent overkills is retest. In this paper, we formulate the problem of reducing overkills and retests as a stochastic optimization problem to determine optimal threshold values concerning the number of good dies and the number of bins in a lot and wafer to decide whether to go for a retest after a regular wafer probing. The considered stochastic optimization problem is an NP hard problem. We propose an Ordinal Optimization theory based two-level method to solve the problem for good enough threshold values to achieve lesser overkills and retests within a reasonable computational time. Applying to a case based on the true mean of bins of a real semiconductor product, the threshold values we obtained are the best among 1000 sets of randomly generated threshold values in the sense of lesser overkills under a tolerable retest rate.",
keywords = "Assembly, Contacts, Costs, Manufacturing processes, Noise measurement, Optimization methods, Packaging machines, Stochastic processes, Testing, Throughput",
author = "Horng, {S. C.} and Lin, {S. Y.} and Cheng, {M. H.} and Yang, {F. Y.} and Liu, {C. H.} and Lee, {W. Y.} and Tsai, {C. H.}",
note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 14th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, ASMC 2003 ; Conference date: 31-03-2003 Through 01-04-2003",
year = "2003",
doi = "10.1109/ASMC.2003.1194508",
language = "English",
series = "ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "286--291",
booktitle = "2003 IEEEI/SEMI Advanced Semiconductor Manufacturing Conference and Workshop",
address = "United States",
}