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Recent development of fabrication technologies of nitride LEDs for performance improvement
Ray Hua Horng
*
, Dong Sing Wuu, Chia Feng Lin, Chun Feng Lai
*
此作品的通信作者
新世代功能性物質研究中心
電子研究所
研究成果
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引文 斯高帕斯(Scopus)
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Keyphrases
Performance Improvement
100%
Fabrication Technology
100%
Thin-film LED
100%
Nitride LEDs
100%
Light Extraction Efficiency
66%
Flip-chip LED (FCLED)
66%
Sapphire
33%
Far-field Pattern
33%
Photonic Crystal
33%
Array Structure
33%
Flip chip
33%
GaN Epilayer
33%
Thermal Dissipation
33%
GaN-based Light-emitting Diodes
33%
Wafer Bonding
33%
Laser Lift-off
33%
GaN Thin Film
33%
Field Polarization
33%
Polarization Properties
33%
Photonic Crystal Surface
33%
Conductive Substrate
33%
Crystal Surface Models
33%
Far-field Distribution
33%
Property Patterns
33%
Film Genre
33%
Micropillar Array
33%
Engineering
Thin Films
100%
Nitride
100%
Performance Improvement
100%
Photonics
50%
Light Extraction Efficiency
50%
Conductive
25%
Light-Emitting Diode
25%
Directional
25%
Field Pattern
25%
Thermal Dissipation
25%
Wafer Bonding
25%
Crystal Surface
25%
Field Distribution
25%
Material Science
Thin Films
100%
Nitride Compound
100%
Photonic Crystal
66%
Surface Structure
33%
Sapphire
33%
Epilayers
33%
Light-Emitting Diode
33%
Thin Film Types
33%