Recent development of fabrication technologies of nitride LEDs for performance improvement

Ray Hua Horng*, Dong Sing Wuu, Chia Feng Lin, Chun Feng Lai

*此作品的通信作者

研究成果: Chapter同行評審

4 引文 斯高帕斯(Scopus)

摘要

In this chapter, we discuss the flip-chip and thin-film types of GaN-based light-emitting diode (LED), which are used to produce devices with better light extraction efficiency and far-field distribution. Flip-chip LEDs (FCLEDs) with a micro-pillar array structure and FCLEDs with a geometric oblique sapphire structure are investigated. Thin-film LEDs (TFLEDs) are fabricated by a combination of wafer bonding and the laser lift-off technique, which are used to transfer the GaN epilayer to a more conductive substrate to give better thermal dissipation. GaN TFLEDs with a photonic crystal (PC) surface structure are demonstrated. This study examines the light extraction efficiency, directional far-field patterns, and polarization properties of GaN PC TFLEDs.

原文English
主出版物標題Nitride Semiconductor Light-Emitting Diodes (LEDs)
主出版物子標題Materials, Technologies, and Applications: Second Edition
發行者Elsevier
頁面209-241
頁數33
ISBN(電子)9780081019436
ISBN(列印)9780081019429
DOIs
出版狀態Published - 1 1月 2018

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