Process-Strained Si (PSS) CMOS Technology Featuring 3D Strain Engineering
C. H. Ge*, C. C. Lin, C. H. Ko, C. C. Huang, Y. C. Huang, B. W. Chan, B. C. Perng, C. C. Sheu, P. Y. Tsai, L. G. Yao, C. L. Wu, T. L. Lee, C. J. Chen, C. T. Wang, S. C. Lin, Y. C. Yeo, Chen-Ming Hu
*此作品的通信作者
研究成果: Conference article › 同行評審
114
引文
斯高帕斯(Scopus)