Preventing dielectric damage of low-k organic siloxane by passivation treatment

T. C. Chang*, Y. S. Mor, Po-Tsun Liu, T. M. Tsai, C. W. Chen, Y. J. Mei, Fu-Ming Pan, W. F. Wu, S. M. Sze

*此作品的通信作者

研究成果: Article同行評審

10 引文 斯高帕斯(Scopus)

指紋

深入研究「Preventing dielectric damage of low-k organic siloxane by passivation treatment」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy