Practical Substrate Design Considering Symmetrical and Shielding Routes

In modern package design, the flip-chip package has become mainstream because of the benefit of its high I/O pins. However, the package design is still done manually in the industry. The lack of automation tools makes the package design cycle longer due to complex routing constraints, and the frequent modification requests. In this work, we propose yet another routing framework for substrate routing. Compared with previous works, our routing algorithm generates a feasible routing solution in a few seconds for industrial design and considers important symmetry and shielding constraints that have not been handled before. Benefiting from the efficiency of our routing algorithm, the designer can get the result immediately and accommodate some modifications to reduce the cost. The experimental result shows that the routing result generated from our router is in good quality, very close to the manual design.