Practical Substrate Design Considering Symmetrical and Shielding Routes

Hao Yu Chi, Simon Yi Hung Chen, Hung Ming Chen, Chien Nan Liu, Yun Chih Kuo, Ya Hsin Chang, Kuan Hsien Ho

研究成果: Conference contribution同行評審

摘要

In modern package design, the flip-chip package has become mainstream because of the benefit of its high I/O pins. However, the package design is still done manually in the industry. The lack of automation tools makes the package design cycle longer due to complex routing constraints, and the frequent modification requests. In this work, we propose yet another routing framework for substrate routing. Compared with previous works, our routing algorithm generates a feasible routing solution in a few seconds for industrial design and considers important symmetry and shielding constraints that have not been handled before. Benefiting from the efficiency of our routing algorithm, the designer can get the result immediately and accommodate some modifications to reduce the cost. The experimental result shows that the routing result generated from our router is in good quality, very close to the manual design.

原文English
主出版物標題Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022
編輯Cristiana Bolchini, Ingrid Verbauwhede, Ioana Vatajelu
發行者Institute of Electrical and Electronics Engineers Inc.
頁面951-956
頁數6
ISBN(電子)9783981926361
DOIs
出版狀態Published - 2022
事件2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022 - Virtual, Online, Belgium
持續時間: 14 3月 202223 3月 2022

出版系列

名字Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022

Conference

Conference2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022
國家/地區Belgium
城市Virtual, Online
期間14/03/2223/03/22

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