Polymer as the protecting passivaton layer in fabricating suspended SCS structures in both anisotropic and isotropic etching

Keyphrases

• Isotropic Etching 100%
• Anisotropic Etching 100%
• Suspended Microstructures 100%
• Passivation Layer 66%
• Polymer Passivation 66%
• Silica 33%
• Silicon Dioxide 33%
• Fabrication Methods 33%
• Multicrystalline Silicon 33%
• Fabrication Parameters 33%
• Inductively Coupled Plasma Reactive Ion Etching 33%
• Boron Doping 33%
• Silicon Structure 33%
• Suspended Structure 33%
• Micromachining Technique 33%
• Open Gap 33%
• Sub-micro 33%
• Protection Layer 33%
• Fabrication Time 33%
• Bulk Micromachining 33%
• Removal Time 33%
• Passivation Time 33%
• Deep Trench 33%

Engineering

• Anisotropic 100%
• Passivation Layer 100%
• Simplifies 50%
• Passivation 50%
• Silicon Single Crystal 50%
• Inductively Coupled Plasma 50%
• Microscale 50%
• Micro Machining 50%
• Protection Layer 50%
• Fabrication Time 50%
• Silicon Dioxide 50%

Material Science

• Reactive Ion Etching 100%
• Silicon Dioxide 100%
• Silicon 100%
• Boron 100%
• Micromachining 100%
• Single Crystal 100%