@inproceedings{e3a7090c5fca4a8f84d4493a7a2a340d,
title = "Phone-nomenon: A system-level thermal simulator for handheld devices",
abstract = "This work presents a system-level thermal simulator, Phone-nomenon, to predict the thermal behavior of smartphone. First, we study the nonlinearity of internal and external heat transfer mechanisms and propose a compact thermal model. After that, we develop an iterative framework to handle the nonlinearity. Compared with a commercial tool, ANSYS Icepak, Phonenomenon can achieve two and three orders of magnitude speedup with 3.58% maximum error and 1.72°C difference for steady-state and transient-state simulations, respectively. Meanwhile, Phone-nomenon also fits the measured data of a built thermal test vehicle pretty well.",
author = "Chiou, {Hong Wen} and Yu-Min Lee and Shiau, {Shin Yu} and Pan, {Chi Wen} and Chen, {Tai Yu}",
note = "Publisher Copyright: {\textcopyright} 2019 Association for Computing Machinery.; 24th Asia and South Pacific Design Automation Conference, ASPDAC 2019 ; Conference date: 21-01-2019 Through 24-01-2019",
year = "2019",
month = jan,
day = "21",
doi = "10.1145/3287624.3287632",
language = "English",
series = "Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "577--584",
booktitle = "ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference",
address = "United States",
}