Performance of cu-plating vertical LEDs in heat dissipation using diamond-like carbon

Ray-Hua Horng, Kun Ching Shen, Ching Ho Tien, Sin Cyuan Lin, Dong Sing Wuu

研究成果: Article同行評審

3 引文 斯高帕斯(Scopus)

摘要

Performance in heat dissipation of Cu-plating type vertical GaN light-emitting diodes (CVLEDs) with a diamond like carbon (DLC) layer was investigated at various injection current levels. Through the incorporation of DLC, the CVLED with DLC exhibits a high heat dissipating ability, where the DLC-CVLEDs can be handled at an ultrahigh injection current of 2000 mA and reach an output power of 620 mW. In addition, the thermal resistance of the CVLED with DLC calculated by surface temperature data at 1400 mA injection current was 34% lower than that of CVLED without DLC, which clearly indicated that the benefit of using DLC layer on improvement of heat dissipation will be more significant as a higher current is injected.

原文English
文章編號6689309
頁(從 - 到)169-171
頁數3
期刊Ieee Electron Device Letters
35
發行號2
DOIs
出版狀態Published - 2月 2014

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