摘要
Poly-SiGe- and poly-Si-gated N/PMOS devices with physical channel lengths down to 0.1μm and gate oxide thicknesses down to 25 angstrom were fabricated. Device performance and reliability were characterized. The poly-SiGe-gated NMOS and PMOS devices provide superior current drive due to less gate-depletion effect and higher inversion hole mobility in poly-SiGe-gated devices. In addition, gate oxide integrity in poly-SiGe-gated MOSFET is as good as poly-Si-gated device. Poly-SiGe-gated PMOSFET has better reliability than poly-Si-gated PMOSFET due to reduction of boron penetration.
| 原文 | English |
|---|---|
| 頁(從 - 到) | 14-18 |
| 頁數 | 5 |
| 期刊 | International Symposium on VLSI Technology, Systems, and Applications, Proceedings |
| DOIs | |
| 出版狀態 | Published - 1999 |
| 事件 | Proceedings of the 1999 International Symposium on VLSI Technology, Systems, and Applications - Taipei, Taiwan 持續時間: 7 6月 1999 → 10 6月 1999 |
指紋
深入研究「Performance enhancement in deep-submicron poly-SiGe-gated CMOS devices」主題。共同形成了獨特的指紋。引用此
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