Performance benchmarking of monolayer and bilayer two-dimensional transition metal dichalcogenide (TMD) based logic circuits

Because of their atomic-scale thickness, adequate band-gap, and pristine interface, monolayer or bilayer two-dimensional transition metal dichalcogenides (TMDs) such as MoS2 and WSe2 (Fig. 1(a)) have emerged as potential channel materials for future ultimately scaled low-power CMOS devices [1-7]. Bilayer TMD devices have been shown to exhibit higher mobility at the expense of device electrostatics compared with monolayer TMD devices [2-6]. While the scalability and performance potential of MoS2 and WSe2 devices have been widely investigated [1-3], a thorough study of the extremely scaled TMD-based logic circuits has been lacking.