Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing

J. Y. Fang*, M. S. Tsai, B. T. Dai, Yew-Chuhg Wu, M. S. Feng

*此作品的通信作者

研究成果: Article › 同行評審

7 引文 斯高帕斯（Scopus）

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Engineering & Materials Science

Physics & Astronomy

Chemical Compounds