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Packaging and reliability issues in micro/nano systems
Yu Chuan Su, Jongbaeg Kim,
Yu Ting Cheng
, Mu Chiao, Liwei Lin
電子研究所
研究成果
:
Chapter
›
同行評審
2
引文 斯高帕斯（Scopus）
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Keyphrases
Reliability Issues
100%
Packaging Process
100%
Micro-nano Systems
100%
Packaging Design
66%
Wafer Level
33%
Commercial Products
33%
Three-dimensional (3D)
33%
Micro-electro-mechanical Systems
33%
System Process
33%
Testing Method
33%
Material Selection
33%
Process Integration
33%
Daily Life
33%
Selling
33%
Commercial Potential
33%
Vacuum Encapsulation
33%
Test Cost
33%
Commercial Application
33%
System Product
33%
Microelectronics
33%
Packaging Technology
33%
Thermal Issues
33%
Successful Implementation
33%
Packaging Technique
33%
Packaging Materials
33%
System Technology
33%
Wafer-level Packaging
33%
Nanoelectromechanical Systems
33%
Interposer
33%
Environmental Instruments
33%
3D Packaging
33%
Device Integration
33%
Hermetic Encapsulation
33%
System Assembly
33%
Reliable Packaging
33%
Space Systems
33%
Packaging Reliability
33%
Wafer-level chip-scale Package (WLCSP)
33%
Advanced Functionalities
33%
Integration Costs
33%
Packaging Cost
33%
System Encapsulation
33%
Packaging Polymers
33%
Design Kit
33%
Effective Testing
33%
Engineering
Reliability Issue
100%
Nano System
100%
Interconnects
50%
Microelectromechanical System
50%
System Technology
50%
Engineering
50%
Process System
50%
Assembly System
50%
Microelectronics
50%
Circuit Designer
50%
Daily Life
50%
Commercial Product
50%
Level Packaging
50%
Process Integration
50%
Main Issue
50%
Space System
50%
Packaging Material
50%
Interposer
50%
System Designer
50%
Successful Implementation
50%
Product System
50%
Nanoelectromechanical System
50%
Material Science
Electronic Circuit
100%
Microelectromechanical System
100%
Material Selection
100%
Device Integration
100%
Packaging Material
100%