Origami-Inspired Conductive Paper-Based Folded Pressure Sensor with Interconnection Scaling at the Crease for Novel Wearable Applications

Rajat Subhra Karmakar, Jhih Fong Huang, Chia Pei Chu, Ming Han Mai, Jui I. Chao, Ying Chih Liao, Yen Wen Lu*

*此作品的通信作者

研究成果: Article同行評審

摘要

Drawing inspiration from origami structures, a pressure sensor was developed with unique interconnection scaling at its creases crafted on a conductive paper substrate, paving the way for advanced wearable technology. Two screen-printed conductive paper substrates were combined face-to-face, and specific folds were introduced to optimize the sensor structure. The Electrical Contact Resistance (ECR) was systematically analyzed across different fold numbers and crease gaps, revealing a notable trade-off: while increasing the number of folds expanded the sensing area, it also influenced the ECR, reaching a performance plateau. Strategic modifications in the sensor’s design, including refining interconnections at the crease, enhanced its sensitivity and stability, culminating in a remarkable sensitivity of 3.75 kPa-1 at subtle pressure levels (0-0.05 kPa). This sensor’s real-world applications proved to be transformative, from detecting bruxism and aiding in neck posture correction to remotely sensing trigger finger locking phenomena, highlighting its potential as a pivotal tool in upcoming medical diagnostics and treatments.

原文English
頁(從 - 到)4231-4241
頁數11
期刊ACS Applied Materials and Interfaces
16
發行號3
DOIs
出版狀態Published - 24 1月 2024

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