Optimizing Device Metal Routing Layouts by the Simulation Tool

Shao Chang Huang*, Ching Ho Li*, Chih Cherng Liao, Jung Tsun Chuang, Chien Wei Wang, Gong Kai Lin, Lin Fan Chen, Chun Chih Chen, Kuan I. Ho, Che Hua Chang, Hsiao Ying Yang, Chung Ren Lao, Jian Hsing Lee, Ke Horng Chen*

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

Device layout is very important for one Integrated Circuit (IC) performance. From different metal routing, ICs can own different achievements. In this study, simple device layouts with only two poly gate fingers are discovered for obtaining the optimizing device characteristics. In order to create the uniform current distributions, lots of metal routing segmentations are preferred, but many segmented metal layouts will induce less effective metal widths. Through the simulation tool, optimizing metal routing can be achieved. Finally, one suggested metal routing method for typical IC applications can be obtained from many simulation results.

原文English
主出版物標題2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面219-220
頁數2
ISBN(電子)9798350324174
DOIs
出版狀態Published - 2023
事件2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Pingtung, Taiwan
持續時間: 17 7月 202319 7月 2023

出版系列

名字2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings

Conference

Conference2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023
國家/地區Taiwan
城市Pingtung
期間17/07/2319/07/23

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