Optimization of the Deposition Condition for Improving the Ti Film Resistance of DRAM Products

Yun-Wei Lin*, Chia Ming Lin

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

Dynamic random access memory (DRAM) products are the key parts in consumer products. To fulfill the current market’s strict specifications, various customers have asked DRAM manufacturers to continue improving the quality of DRAM products. The resistance of the Ti film directly affects the electrical quality of DRAM products. At present, the DRAM products developed by the case company have caused customer returns due to abnormal resistance value of Ti film. Process engineers always adjust the engineering parameters based on experience, which resulted in slow improvement and inability to determine the setting of engineering parameters. Consequently, shipments of DRAM products are delayed. This study adopts the Ti film resistance of DRAM products as the main research object for improvement and applies the response surface method, neural networks, and genetic algorithms to help process engineers analyze and improve DRAM products. This work assists the case company in achieving a significant improvement in Ti film resistance from 210.33 Ω (the origin made by the case company) to 185.28 Ω (the improvement made by this work) where the specified target value is 185 Ω. The results are effective in shortening the improvement time and reducing customer returns.

原文English
主出版物標題Smart Grid and Internet of Things - 4th EAI International Conference, SGIoT 2020, Proceedings
編輯Yi-Bing Lin, Der-Jiunn Deng
發行者Springer Science and Business Media Deutschland GmbH
頁面527-542
頁數16
ISBN(列印)9783030695132
DOIs
出版狀態Published - 5 12月 2021
事件4th EAI International Conference on Smart Grid and Internet of Things, SGIoT 2020 - TaiChung, 台灣
持續時間: 5 12月 20206 12月 2020

出版系列

名字Lecture Notes of the Institute for Computer Sciences, Social-Informatics and Telecommunications Engineering, LNICST
354
ISSN(列印)1867-8211
ISSN(電子)1867-822X

Conference

Conference4th EAI International Conference on Smart Grid and Internet of Things, SGIoT 2020
國家/地區台灣
城市TaiChung
期間5/12/206/12/20

指紋

深入研究「Optimization of the Deposition Condition for Improving the Ti Film Resistance of DRAM Products」主題。共同形成了獨特的指紋。

引用此