Optimization of gate insulator material for GaN MIS-HEMT

Y. C. Lin, T. W. Lin, C. H. Wu, J. N. Yao, H. T. Hsu, W. C. Shih, K. Kakushima, K. Tsutsui, H. Iwai, E. Y. Chang

研究成果: Conference contribution同行評審

9 引文 斯高帕斯(Scopus)

摘要

Metal-insulator-semiconductor (M-I-S) structure has been employed for GaN HEMTs to suppress gate leakage current. In this work, various gate insulator materials including SiO2, HfO2, La2O3, HfO2/SiO2 and La2O3/SiO2 were investigated for GaN MIS-HEMT application. It is found that GaN MIS-HEMT with La2O3/SiO2 composite oxide results in better device performance and reliability as compared to other gate insulator materials.

原文English
主出版物標題Proceedings of the 2016 28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016
發行者Institute of Electrical and Electronics Engineers Inc.
頁面115-118
頁數4
ISBN(電子)9781467387682
DOIs
出版狀態Published - 25 7月 2016
事件28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016 - Prague, 捷克共和國
持續時間: 12 6月 201616 6月 2016

出版系列

名字Proceedings of the International Symposium on Power Semiconductor Devices and ICs
2016-July
ISSN(列印)1063-6854

Conference

Conference28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016
國家/地區捷克共和國
城市Prague
期間12/06/1616/06/16

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