On-Interposer Decoupling Capacitors Placement for Interposer-based 3DIC

Po Yang Chen*, Chang Yun Liu, Hung Ming Chen, Po Tsang Huang

*此作品的通信作者

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

With the demand for high performance and density, silicon interposer-based three-dimensional integrated circuit (3DIC) can be one of promising solutions for these requirements. However, simultaneously switching noise (SSN) will cause voltage fluctuation and hence performance degradation and logic failure might occur. Our work proposes an efficient Simulated Annealing (SA) based algorithm to perform decap placement automatically on the interposer. In our solution, target impedance can be achieved within certain frequency range. Results show that number of decaps as well as impedance of PDN are minimized to meet the requirement.

原文English
主出版物標題Proceedings of the 24th International Symposium on Quality Electronic Design, ISQED 2023
發行者IEEE Computer Society
ISBN(電子)9798350334753
DOIs
出版狀態Published - 2023
事件24th International Symposium on Quality Electronic Design, ISQED 2023 - San Francisco, United States
持續時間: 5 4月 20237 4月 2023

出版系列

名字Proceedings - International Symposium on Quality Electronic Design, ISQED
2023-April
ISSN(列印)1948-3287
ISSN(電子)1948-3295

Conference

Conference24th International Symposium on Quality Electronic Design, ISQED 2023
國家/地區United States
城市San Francisco
期間5/04/237/04/23

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