TY - GEN
T1 - NUMANA
T2 - 16th Design, Automation and Test in Europe Conference and Exhibition, DATE 2013
AU - Lee, Yu-Min
AU - Wu, Tsung Heng
AU - Huang, Pei Yu
AU - Yang, Chi Ping
PY - 2013/10/21
Y1 - 2013/10/21
N2 - By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.
AB - By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.
UR - http://www.scopus.com/inward/record.url?scp=84885620229&partnerID=8YFLogxK
U2 - 10.7873/DATE.2013.282
DO - 10.7873/DATE.2013.282
M3 - Conference contribution
AN - SCOPUS:84885620229
SN - 9783981537000
T3 - Proceedings -Design, Automation and Test in Europe, DATE
SP - 1379
EP - 1384
BT - Proceedings - Design, Automation and Test in Europe, DATE 2013
Y2 - 18 March 2013 through 22 March 2013
ER -