TY - GEN
T1 - Novel Strain Release Self-Assembly Design of Silver Nanowires and Application in Flexible Strain Sensors
AU - Chen, Yen Shuo
AU - Ko, Yu Chien
AU - Fan, Hua Tai
AU - Lin, Ching Chang
AU - Ko, Fu Hsiang
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - In this study, a new strategy 'room temperature surface treatment stencil patterning method' is proposed to print silver nanowires (AgNWs) electrode patterns on Polydimethylsiloxane (PDMS) substrates and align AgNWs in the patterns by strain-release assembly method. By using a shadow mask and oxygen plasma treatment, proper wide AgNWs serpentine electrodes were fabricated, and the AgNWs were aligned in the same direction by the strain-release assembly method. The bending test results of the flexible strain sensor showed that the device change of the current was almost linear to the strain with a measurement factor of 6.4, that the device could deform about 17.5% with more than 1000 operations, and that the current of the device stabilized within 2 min. The results indicate that the device has excellent potential for flexible strain sensor applications.
AB - In this study, a new strategy 'room temperature surface treatment stencil patterning method' is proposed to print silver nanowires (AgNWs) electrode patterns on Polydimethylsiloxane (PDMS) substrates and align AgNWs in the patterns by strain-release assembly method. By using a shadow mask and oxygen plasma treatment, proper wide AgNWs serpentine electrodes were fabricated, and the AgNWs were aligned in the same direction by the strain-release assembly method. The bending test results of the flexible strain sensor showed that the device change of the current was almost linear to the strain with a measurement factor of 6.4, that the device could deform about 17.5% with more than 1000 operations, and that the current of the device stabilized within 2 min. The results indicate that the device has excellent potential for flexible strain sensor applications.
UR - http://www.scopus.com/inward/record.url?scp=85182019370&partnerID=8YFLogxK
U2 - 10.1109/NMDC57951.2023.10344296
DO - 10.1109/NMDC57951.2023.10344296
M3 - Conference contribution
AN - SCOPUS:85182019370
T3 - 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023
SP - 761
EP - 765
BT - 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th IEEE Nanotechnology Materials and Devices Conference, NMDC 2023
Y2 - 22 October 2023 through 25 October 2023
ER -