Novel Octagonal Device Structure for Output Transistors in Deep-Submicron Low-Voltage CMOS Technology

Ming-Dou Ker*, Tain Shun Wu

*此作品的通信作者

研究成果: Conference article同行評審

6 引文 斯高帕斯(Scopus)

摘要

A novel device structure to effectively reduce the layout area of CMOS output buffers with higher ESD reliability is proposed. Experimental results have shown that the output driving (sinking) current of output buffers in per unit layout area is increased 47.7% (34.3%) by this octagon-type design. The HBM (MM) ESD robustness of this octagon-type output buffer in per unit layout area is also increased 41.5% (84.6%), as comparing to the traditional finger-type output buffer.

原文English
文章編號5552565
頁(從 - 到)889-892
頁數4
期刊Technical Digest - International Electron Devices Meeting, IEDM
DOIs
出版狀態Published - 1996
事件Proceedings of the 1996 IEEE International Electron Devices Meeting - San Francisco, CA, USA
持續時間: 8 12月 199611 12月 1996

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