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Novel mold-resistant building materials impregnated with thermally reduced nano-silver
Y. C. Chen,
K. P. Yu
*
, W. C. Shao, C. H. Tseng,
W. C. Pan
*
此作品的通信作者
環境與職業衛生研究所
研究成果
:
Article
›
同行評審
10
引文 斯高帕斯(Scopus)
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Keyphrases
Activity Reduction
14%
Ag +
14%
Ag Nanoparticles (AgNPs)
100%
Agar Plate
14%
Antifungal Activity
28%
Antifungal Efficiency
14%
Aspergillus Niger
14%
Building Materials
100%
Cement Board
28%
Critical Concentration
14%
Fungal Growth
14%
Fungal Species
14%
Gypsum Board
28%
Gypsum Cements
14%
High Temperature
14%
Humidity
14%
Loading Level
42%
Low Silver
14%
Mould Growth
14%
Nanosilver
100%
Penicillium
14%
Plywood
28%
Reduction Temperature
42%
Regression Results
14%
Rutile
85%
Silver Loading
42%
Silver Nanoparticles
14%
Softwood
28%
Spinulosa
14%
Stachybotrys Chartarum
14%
Stepwise Regression
14%
Thermal Reduction
42%
Thermally Reduced
100%
TiO2 Surface
14%
Weight Percentage
14%
Agricultural and Biological Sciences
Agar
50%
Aspergillus Niger
50%
Nanoparticle
50%
Penicillium
50%
Relative Humidity
50%
Softwood Plywood
100%
Stachybotrys Chartarum
50%
Titanium Dioxide
50%
Engineering
Building Interior
14%
Building Material
100%
Critical Concentration
14%
Gypsum Board
28%
Major Factor
14%
Mould Growth
14%
Relative Humidity
14%
Silver Nanoparticle
100%