Novel High Throughput-to-Area Efficiency and Strong-Resilience Datapath of AES for Lightweight Implementation in IoT Devices

Pao Ying Cheng, Ying Cheng Su, Paul C.P. Chao*

*此作品的通信作者

研究成果: Article › 同行評審

1 引文 斯高帕斯（Scopus）

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Keyphrases

Computer Science

Engineering