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Novel heat dissipation design for light emitting diode applications
Chao Chi Chang, De Shau Huang, Ming Tzer Lin
*
,
Ray-Hua Horng
, Chi Ming Lai
*
此作品的通信作者
電子研究所
研究成果
:
Article
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同行評審
6
引文 斯高帕斯（Scopus）
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Keyphrases
Light-emitting Diodes
100%
Diode Application
100%
Heat Dissipation Design
100%
Chip Temperature
22%
Electroplated Copper
22%
Heat pipe
22%
Efficient Heat Dissipation
22%
Copper Layer
22%
Working Fluid
11%
Thermal Resistance
11%
Proposed Design
11%
Heat Dissipation
11%
Thermal Dissipation
11%
Rotation Angle
11%
Water Volume
11%
Steam
11%
Heat Sink Design
11%
Packaging Materials
11%
Behavior Analysis
11%
Water Temperature
11%
3D Finite Element Model
11%
Thermal Diffusion
11%
Heat Transfer Behavior
11%
Heat pipe Cooling
11%
Light-emitting Diode Illumination
11%
Diffusion Efficiency
11%
Heat pipe System
11%
Fluid Rotation
11%
Fluid Mass
11%
Material Assembly
11%
Layer Assembly
11%
Thermal Increase
11%
Engineering
Light-Emitting Diode
100%
Heat Losses
100%
Heat Pipes
44%
Thin Layer
11%
Thermal Dissipation
11%
Rotation Angle
11%
Finite Element Simulation
11%
Pipe System
11%
Packaging Material
11%
Temperature Water
11%
Thermal Diffusion
11%
Light-Emitting Diode Illumination
11%
Fluid Mass
11%
Reduced Temperature
11%
Heat Resistance
11%