Novel Cu-to-Cu bonding with Ti passivation at 180^{\circ}{\rm C} in 3-D integration

Yan Pin Huang, Yu San Chien, Ruoh Ning Tzeng, Ming Shaw Shy, Teu Hua Lin, Kou Hua Chen, Chi Tsung Chiu, Jin-Chern Chiou, Ching Te Chuang, Wei Hwang, Ho Ming Tong, Kuan-Neng Chen

研究成果: Article › 同行評審

92 引文 斯高帕斯（Scopus）

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Engineering