Novel application of ring-oscillator-based sensor for 3D IC temperature and IR drop monitoring

Jin-Chern Chiou, Tzu Sen Yang, Shang Wei Tsai

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

This paper proposes a novel method to clearly differentiate the distinct problems of temperature and IR drop inside a chip. This method involves the placement of two same ring-oscillator-based sensors in specific areas. Simulation results show that as temperature increases, the digital counter output of the ring-oscillator-based sensor decreases. Alternatively, a decrease in the power supply decreases the digital output of the ring-oscillator-based sensor. Results also show that when the digital circuit speed was slow, the difference between the digital count outputs of the two sensors became very small; this difference was very large when the speed was high. Thus, the difference between the digital count outputs of the two sensors represents the internal power status of the chip.

原文English
主出版物標題2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1-3
頁數3
ISBN(電子)9781538612385
DOIs
出版狀態Published - 2 7月 2017
事件2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 - Haining, Zhejiang, China
持續時間: 14 12月 201716 12月 2017

出版系列

名字2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
2018-January

Conference

Conference2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
國家/地區China
城市Haining, Zhejiang
期間14/12/1716/12/17

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