@inproceedings{36c108160cfb4dd4be97d61f03466261,
title = "Nondestructive optical inspection system for the dicing street quality of copper/low-k wafer",
abstract = "To resolve the issue in detecting sidewall crack defect mode in the die singulation of copper/low-k wafer after laser pre-groove/cleaning process, we combine a dedicated optical system with automatic optical inspection system in the production line for the nondestructive wafer-by-wafer optical inspection system to inspect the dicing street quality of copper/low-k wafer. Experiment shows that the sidewall crack defect can be clearly identified with the proposed inspection system and it is potentially applicable for the production line.",
keywords = "copper/low-k wafer, nondestructive optical inspection, scattering, sidewall crack",
author = "Lin, {Sheng Feng} and Cheng-Huan Chen and Lo, {Cheng Yao}",
year = "2015",
month = nov,
day = "30",
doi = "10.1109/SIITME.2015.7342299",
language = "English",
series = "2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "77--81",
booktitle = "2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015",
address = "美國",
note = "21st IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2015 ; Conference date: 22-10-2015 Through 25-10-2015",
}