Non-destructive Observation of Void Formation Due to Electromigration in Solder Microbump by 3D X-ray

Kai Cheng Shie, Tzu Wen Lin, King-Ning Tu, Chih Chen

研究成果: Conference contribution › 同行評審

2 引文 斯高帕斯（Scopus）

指紋

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Keyphrases

Engineering

Material Science