Nickel nano-composite film for MEMS applications

Kwok Siong Teh*, Yu-Ting Cheng, Liwei Lin

*此作品的通信作者

研究成果: Conference contribution同行評審

13 引文 斯高帕斯(Scopus)

摘要

We have successfully demonstrated low-temperature, stress-free, wafer-level fabrication of nano-composite MEMS via both an electroless nickel (EN) and an electrolytic nickel (EL) deposition process, with the addition of uniformly dispersed nanoparticles of either cordierite (diameter ≈100 nm∼5 μm) or diamond (diameter ∼4 nm). The as-deposited nickel-cordierite films exhibit better thermal compatibility with Si, compared to nickel. The measured coefficient of thermal expansion (CTE) of EN-cordierite and EN is 17.34 ppm/K and 26.69 ppm/K, respectively. Stress-temperature measurement of EN-cordierite composite also confirms that residual stress decreases with the incorporations of cordierite. Finally, by adding various concentrations of nanodiamond particles into an EL matrix, it is found that higher diamond concentrations render the film to be more compressively stressed.

原文English
主出版物標題TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1534-1537
頁數4
ISBN(電子)0780377311, 9780780377318
DOIs
出版狀態Published - 1 一月 2003
事件12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
持續時間: 8 六月 200312 六月 2003

出版系列

名字TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
2

Conference

Conference12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
國家/地區United States
城市Boston
期間8/06/0312/06/03

指紋

深入研究「Nickel nano-composite film for MEMS applications」主題。共同形成了獨特的指紋。

引用此