Negotiation-based layer assignment for via count and via overflow minimization

Wen H. Liu*, Yih-Lang Li

*此作品的通信作者

研究成果: Conference contribution同行評審

22 引文 斯高帕斯(Scopus)

指紋

深入研究「Negotiation-based layer assignment for via count and via overflow minimization」主題。共同形成了獨特的指紋。

Engineering & Materials Science