Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding

Chia Hsin Lee; Chung An Tan; Michelle Fowler; Ting Yu Ko; Yu Min Lin; Wei Lan Chiu; Ou Hsiang Lee; Kuan Neng Chen

doi:10.1109/TCPMT.2023.3301005

Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding

Chia Hsin Lee, Chung An Tan, Michelle Fowler, Ting Yu Ko, Yu Min Lin, Wei Lan Chiu, Ou Hsiang Lee, Kuan Neng Chen^*

^*此作品的通信作者

研究成果: Article › 同行評審

3 引文斯高帕斯（Scopus）

摘要

This article presents an evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric material has a Tg ≤ 100°C; Young's modulus of 99 MPa, the dielectric constant of 2.6, and dissipation factor of 0.0016 at 10 GHz. Shear tests revealed a bond shear strength of over 10 MPa when prebonded at 30 °C. Subsequent thermal compression bonding (TCB) at 300 °C for 1 h increased the bond shear strength to over 60 MPa. The material is compatible with the typical Cu damascene process involving lithography, Ti barrier layer deposition, Cu seed layer deposition, Cu electroplating, and Cu chemical mechanical polish (CMP). The photosensitive nature of the low-Tg polymeric bonding material, along with its compatibility with the Cu damascene process, opens up possibilities for low-temperature Cu/polymer hybrid bonding.

原文	English
頁（從 - 到）	1316-1323
頁數	8
期刊	IEEE Transactions on Components, Packaging and Manufacturing Technology
卷	13
發行號	8
DOIs	https://doi.org/10.1109/TCPMT.2023.3301005
出版狀態	Published - 1 8月 2023

存取文件

10.1109/TCPMT.2023.3301005

其它文件與鏈接

Link to publication in Scopus

引用此

@article{01ad1be47db04e659b35c78cc400a255,

title = "Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding",

abstract = "This article presents an evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric material has a Tg ≤ 100°C; Young's modulus of 99 MPa, the dielectric constant of 2.6, and dissipation factor of 0.0016 at 10 GHz. Shear tests revealed a bond shear strength of over 10 MPa when prebonded at 30 °C. Subsequent thermal compression bonding (TCB) at 300 °C for 1 h increased the bond shear strength to over 60 MPa. The material is compatible with the typical Cu damascene process involving lithography, Ti barrier layer deposition, Cu seed layer deposition, Cu electroplating, and Cu chemical mechanical polish (CMP). The photosensitive nature of the low-Tg polymeric bonding material, along with its compatibility with the Cu damascene process, opens up possibilities for low-temperature Cu/polymer hybrid bonding.",

keywords = "25-D/3-D packaging, damascene process, hybrid bonding, photosensitive bonding material",

author = "Lee, {Chia Hsin} and Tan, {Chung An} and Michelle Fowler and Ko, {Ting Yu} and Lin, {Yu Min} and Chiu, {Wei Lan} and Lee, {Ou Hsiang} and Chen, {Kuan Neng}",

note = "Publisher Copyright: {\textcopyright} 2011-2012 IEEE.",

year = "2023",

month = aug,

day = "1",

doi = "10.1109/TCPMT.2023.3301005",

language = "English",

volume = "13",

pages = "1316--1323",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "8",

}

TY - JOUR

T1 - Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding

AU - Lee, Chia Hsin

AU - Tan, Chung An

AU - Fowler, Michelle

AU - Ko, Ting Yu

AU - Lin, Yu Min

AU - Chiu, Wei Lan

AU - Lee, Ou Hsiang

AU - Chen, Kuan Neng

PY - 2023/8/1

Y1 - 2023/8/1

N2 - This article presents an evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric material has a Tg ≤ 100°C; Young's modulus of 99 MPa, the dielectric constant of 2.6, and dissipation factor of 0.0016 at 10 GHz. Shear tests revealed a bond shear strength of over 10 MPa when prebonded at 30 °C. Subsequent thermal compression bonding (TCB) at 300 °C for 1 h increased the bond shear strength to over 60 MPa. The material is compatible with the typical Cu damascene process involving lithography, Ti barrier layer deposition, Cu seed layer deposition, Cu electroplating, and Cu chemical mechanical polish (CMP). The photosensitive nature of the low-Tg polymeric bonding material, along with its compatibility with the Cu damascene process, opens up possibilities for low-temperature Cu/polymer hybrid bonding.

AB - This article presents an evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric material has a Tg ≤ 100°C; Young's modulus of 99 MPa, the dielectric constant of 2.6, and dissipation factor of 0.0016 at 10 GHz. Shear tests revealed a bond shear strength of over 10 MPa when prebonded at 30 °C. Subsequent thermal compression bonding (TCB) at 300 °C for 1 h increased the bond shear strength to over 60 MPa. The material is compatible with the typical Cu damascene process involving lithography, Ti barrier layer deposition, Cu seed layer deposition, Cu electroplating, and Cu chemical mechanical polish (CMP). The photosensitive nature of the low-Tg polymeric bonding material, along with its compatibility with the Cu damascene process, opens up possibilities for low-temperature Cu/polymer hybrid bonding.

KW - 25-D/3-D packaging

KW - damascene process

KW - hybrid bonding

KW - photosensitive bonding material

UR - http://www.scopus.com/inward/record.url?scp=85166760482&partnerID=8YFLogxK

U2 - 10.1109/TCPMT.2023.3301005

DO - 10.1109/TCPMT.2023.3301005

M3 - Article

AN - SCOPUS:85166760482

SN - 2156-3950

VL - 13

SP - 1316

EP - 1323

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 8

ER -

Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding

摘要

存取文件

其它文件與鏈接

指紋

引用此