Nanomechanical properties of Ag solder bumps doped with Pd and Au

Hua Chiang Wen*, Wu-Ching Chou, Shiuan-Huei Lin, Don Son Jiang

*此作品的通信作者

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

As an approach to increasing their reliability, we doped Ag solder bumps with Pd and Au alloys to enhance their creep resistance, which we characterized using a nanoindentation technique. The hardnesses of the pure Ag and the Ag solders doped with Pd:3%, Pd:5%, and Pd:2%-Au:3% were 0.6 ± 0.1, 1.8 ± 0.2, 2.8 ± 0.3, and 3.1 ± 0.5 GPa, respectively. Although the hardness of the Ag solder was enhanced significantly when it contained Pd:2%-Au:3%, it exhibited a lower creep exponent (n > 2). The mechanism of the thermal recovery of the sample appears to be associated with activation of dislocation sources—also the reason for the decrease in hardness. The compounds doped with Pd:2%-Au:3% displayed significantly greater bond strengths and creep exponents, whereas the Pd-only compounds exhibited poorer reliability.

原文English
頁(從 - 到)270-275
頁數6
期刊Microelectronics Reliability
79
DOIs
出版狀態Published - 1 12月 2017

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