Multi-layer adaptive power management architecture for TSV 3DIC applications

Ming Hung Chang, Wei Chih Hsieh, Pei Chen Wu, Ching Te Chuang, Kuan-Neng Chen, Chen Chao Wang, Chun Yen Ting, Kua Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Wei Hwang

    研究成果: Conference contribution同行評審

    2 引文 斯高帕斯(Scopus)

    摘要

    In this work, a multi-layer hierarchical distributed power delivery architecture for TSV 3DIC is proposed. By decoupling global and local power networks, the proposed power delivery architecture can be flexibly configured for different power requests. The decoupled power architectures can also greatly reduce the required decoupling capacitor sizes for voltage stabilization. Meanwhile, a multi-threshold CMOS switched capacitor DC-DC converter with up to 78% power efficiency is implemented in 65nm CMOS for hierarchical distributed power delivery architecture. An adaptive power management technique is presented to work in the local power network to increase the power efficiency. The proposed multi-layer hierarchical distributed power delivery architecture is also very useful for the heterogeneous integration in 3DIC chips.

    原文English
    主出版物標題2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
    頁面1179-1185
    頁數7
    DOIs
    出版狀態Published - 9 9月 2013
    事件2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
    持續時間: 28 5月 201331 5月 2013

    出版系列

    名字Proceedings - Electronic Components and Technology Conference
    ISSN(列印)0569-5503

    Conference

    Conference2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
    國家/地區United States
    城市Las Vegas, NV
    期間28/05/1331/05/13

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