@inproceedings{01a40e7f32d544cb86e1dc28573bebec,
title = "Multi-angle bended heat pipe design using X-architecture routing with dynamic thermal weight on mobile devices",
abstract = "Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones.",
author = "Hsiao, {Hsuan Hsuan} and Chiou, {Hong Wen} and Yu-Min Lee",
year = "2019",
month = jan,
day = "21",
doi = "10.1145/3287624.3287666",
language = "English",
series = "Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "70--75",
booktitle = "ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference",
address = "United States",
note = "null ; Conference date: 21-01-2019 Through 24-01-2019",
}