TY - GEN
T1 - Multi-angle bended heat pipe design using X-architecture routing with dynamic thermal weight on mobile devices
AU - Hsiao, Hsuan Hsuan
AU - Chiou, Hong Wen
AU - Lee, Yu-Min
N1 - Publisher Copyright:
© 2019 Association for Computing Machinery.
PY - 2019/1/21
Y1 - 2019/1/21
N2 - Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones.
AB - Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones.
UR - http://www.scopus.com/inward/record.url?scp=85061158155&partnerID=8YFLogxK
U2 - 10.1145/3287624.3287666
DO - 10.1145/3287624.3287666
M3 - Conference contribution
AN - SCOPUS:85061158155
T3 - Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
SP - 70
EP - 75
BT - ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th Asia and South Pacific Design Automation Conference, ASPDAC 2019
Y2 - 21 January 2019 through 24 January 2019
ER -