Multi-angle bended heat pipe design using X-architecture routing with dynamic thermal weight on mobile devices

Hsuan Hsuan Hsiao, Hong Wen Chiou, Yu-Min Lee

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones.

原文English
主出版物標題ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference
發行者Institute of Electrical and Electronics Engineers Inc.
頁面70-75
頁數6
ISBN(電子)9781450360074
DOIs
出版狀態Published - 21 一月 2019
事件24th Asia and South Pacific Design Automation Conference, ASPDAC 2019 - Tokyo, Japan
持續時間: 21 一月 201924 一月 2019

出版系列

名字Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference24th Asia and South Pacific Design Automation Conference, ASPDAC 2019
國家/地區Japan
城市Tokyo
期間21/01/1924/01/19

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