Motion of W marker during sequential compound formation in bimetallic AlCu thin films

H. T.G. Hentzell*, R. D. Thompson, King-Ning Tu

*此作品的通信作者

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

Discontinuous W films have been used as diffusion markers to study interdiffusion during the sequential formation of CuAl2, CuAl and Cu9Al4 intermetallic compounds in bimetallic Al and Cu thin films. Rutherford backscattering spectroscopy has been used to determine marker displacement. For the formation of CuAl2 between Cu and Al, both diffuse. For the formation of CuAl between Cu and CuAl2, Cu is the dominant diffusing species. However, for the formation of Cu9Al4 between Cu and CuAl, again both Cu and Al diffuse.

原文English
頁(從 - 到)81-84
頁數4
期刊Materials Letters
2
發行號2
DOIs
出版狀態Published - 1 1月 1983

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