MOEMS Vibration Sensor with Organic Semiconductor Readout

A. Kainz*, W. Hortschitz, H. Steiner, Yi Hong Hong, Chao Hsuan Chen, Hsiao-Wen Zan, Hsin-Fei Meng, T. Sauter, F. Keplinger


研究成果: Conference article同行評審

1 引文 斯高帕斯(Scopus)


We present a first proof of principle of applying organic semiconductors as key components in micro-mechanical vibration sensors. The mechanical part of the MOEMS sensor readout is etched into the device layer of an SOI chip and consists of a laterally deflecting inertial mass that features a two-dimensional grid of rectangular holes. An identical grid is evaporated onto a glass chip bonded onto the silicon chip in such way that any deflection of the seismic mass will modulate the light flux passing through the device. The light flux is provided in this case by an OLED and detected by an OPD. It is shown with a proof of concept device that for such sensors organic optoelectronics can replace inorganic ones, which is the starting point for developing a variety of MOEMS sensors based on printed optoelectronic devices.

頁(從 - 到)1253-1256
期刊Procedia Engineering
出版狀態Published - 1 1月 2016
事件30th Eurosensors Conference, Eurosensors 2016 - Budapest, Hungary
持續時間: 4 9月 20167 9月 2016


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