Modelling color breaking in a holographic-optical-element based augmented reality display: effects on waveguide thickness

Zih Fan Chen*, Shiuan Huei Lin, Vera Marinova, Ken Y. Hsu

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

In this paper, we present theoretic modelling of color breaking in a holographic-optical-element based augmented reality (AR) display. We first build up a theoretic optical model of the AR display system using scalar diffraction method. The discussions about the design parameters of holographic optical elements (HOE) for augmented reality (AR) glasses, focusing on color uniformity as a function of the waveguide thickness are conducted. It can be used to evaluate the color breaking of a displayed white image from user’s point of view. The simulation results show that color breaking occurs due to the limitations of pupil size and image shifting caused by the extended eye-box. Moreover, the thickness of the waveguide also cause uneven color distribution. Our model can also provide a way to analyze the relationship between waveguide thickness and color uniformity. In addition, based on those results, we propose a color correction algorithm by applying a pre-compensation scheme to the R/G/B values of each display pixel. Results show light display colors can be better corrected in the wider region of user’s field of view. It demonstrates the feasibility of compensation of color breaking in a holographic-optical-element based AR display.

原文English
主出版物標題Photonic Fiber and Crystal Devices
主出版物子標題Advances in Materials and Innovations in Device Applications XVII
編輯Shizhuo Yin, Ruyan Guo
發行者SPIE
ISBN(電子)9781510665781
DOIs
出版狀態Published - 2023
事件Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications XVII 2023 - San Diego, 美國
持續時間: 20 8月 2023 → …

出版系列

名字Proceedings of SPIE - The International Society for Optical Engineering
12682
ISSN(列印)0277-786X
ISSN(電子)1996-756X

Conference

ConferencePhotonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications XVII 2023
國家/地區美國
城市San Diego
期間20/08/23 → …

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