@inproceedings{8d7e18c0ba7d49deb5fb68d4b7b3d25b,
title = "Modeling of Hot-Via Technology for System-in-Package at Millimeter-wave Frequencies",
abstract = "Hot via technology plays an important role for system integration at millimeter-wave frequencies. Accurate prediction of the parasitics is necessary to ensure proper impedance matching for system applications. In this paper, we report the characterization of hot-via interconnect for system-in-package (SiP) applications at millimeter-wave frequencies. A test structure using microstrip to grounded coplanar waveguide (GCPW) transition has been characterized to extract the equivalent circuit model of the hot-via. The model demonstrates an excellent agreement with measurements up to 50 GHz.",
keywords = "grounded coplanar waveguide, hot-via, interconnect, microstrip",
author = "Tsao, {Yi Fan} and Yuan Wang and Serguei Chevtchenko and Mihaela Wolf and Joachim Wurfl and Hsu, {Heng Tung}",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022 ; Conference date: 29-08-2022 Through 31-08-2022",
year = "2022",
doi = "10.1109/RFIT54256.2022.9882348",
language = "English",
series = "RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "88--89",
booktitle = "RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology",
address = "美國",
}