Modeling of Hot-Via Technology for System-in-Package at Millimeter-wave Frequencies

Yi Fan Tsao, Yuan Wang, Serguei Chevtchenko, Mihaela Wolf, Joachim Wurfl, Heng Tung Hsu

研究成果: Conference contribution同行評審

摘要

Hot via technology plays an important role for system integration at millimeter-wave frequencies. Accurate prediction of the parasitics is necessary to ensure proper impedance matching for system applications. In this paper, we report the characterization of hot-via interconnect for system-in-package (SiP) applications at millimeter-wave frequencies. A test structure using microstrip to grounded coplanar waveguide (GCPW) transition has been characterized to extract the equivalent circuit model of the hot-via. The model demonstrates an excellent agreement with measurements up to 50 GHz.

原文English
主出版物標題RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology
發行者Institute of Electrical and Electronics Engineers Inc.
頁面88-89
頁數2
ISBN(電子)9781665466493
DOIs
出版狀態Published - 2022
事件2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022 - Busan, Korea, Republic of
持續時間: 29 8月 202231 8月 2022

出版系列

名字RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology

Conference

Conference2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022
國家/地區Korea, Republic of
城市Busan
期間29/08/2231/08/22

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