Modeling of Cu-Cu Thermal Compression Bonding

Kai Cheng Shie, Dinh Phuc Tran, A. M. Gusak, King-Ning Tu, Hung Che Liu, Chih Chen

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)


A simple bonding model is proposed to correlate the bonding time with some parameters such as surface roughness, temperature, pressure, and grain boundary diffusivity. The theoretical bonding time is defined as the time required for the bonding area to reach 95% of the surface area. Cu-Cu direct bonding is accomplished through the surface creep mechanism, which are divided into four stages, surface contact and plastic deformation, isolated void and grain boundary formation, interfacial void ripening, and interface elimination by grain growth. In this study, we established a surface creep model for the second bonding stage. The driving force is a pressure gradient, which triggers Cu atoms to fill voids at the bonding interface via grain boundary and surface diffusion. This is driven by the release of Gibbs free energy in the system. We took the critical parameters, including surface roughness, bonding temperature, and pressure into account of the model. Using such a kinetic model, we are able to estimate the theoretical bonding time as functions of surface roughness, grain boundary diffusivity, temperature, and pressure. The results indicate that surface roughness and orientation play critical roles on the bonding time. The theoretic bonding time is estimated as 104 s for the Cu films with a surface roughness of 10 nm bonded at 200 °C and 0.5 MPa. As the surface roughness is reduced to 1.0 nm, a bonding time of 10 s is predicted.

主出版物標題Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
發行者Institute of Electrical and Electronics Engineers Inc.
出版狀態Published - 2022
事件72nd IEEE Electronic Components and Technology Conference, ECTC 2022 - San Diego, United States
持續時間: 31 5月 20223 6月 2022


名字Proceedings - Electronic Components and Technology Conference


Conference72nd IEEE Electronic Components and Technology Conference, ECTC 2022
國家/地區United States
城市San Diego


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