TY - GEN
T1 - ML/DL-Based Signal Integrity Optimization for InFO Routing
AU - Kang, Bo Kai
AU - Chang, Hao Ju
AU - Chen, Hung Ming
AU - Liu, Chien Nan Jimmy
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Signal integrity (SI) has been a critical concern in IC/package routing due to the importance in timing and function. However, very few researches discuss related issues in advanced packaging solutions such as InFO (Integrated Fan-Out) structure. This work proposes a new InFO routing flow that improves SI and makes the InFO router SI-aware by integrating well-trained ML/DL models. First, we adopt multiple shielding structures to reduce the impact of crosstalk and obtain eye diagrams to verify the SI improvement. Next, we utilize eye diagram simulation results obtained from the previous step to train the models. Lastly, we integrate the ML/DL models into the InFO router. To evaluate the SI improvement, we apply our new InFO routing flow on several HBM3 testcases, and observe SI improvement in worst eye height ranging from 7.69% to 11.27% and in average eye height ranging from 8.52% to 9.54%.
AB - Signal integrity (SI) has been a critical concern in IC/package routing due to the importance in timing and function. However, very few researches discuss related issues in advanced packaging solutions such as InFO (Integrated Fan-Out) structure. This work proposes a new InFO routing flow that improves SI and makes the InFO router SI-aware by integrating well-trained ML/DL models. First, we adopt multiple shielding structures to reduce the impact of crosstalk and obtain eye diagrams to verify the SI improvement. Next, we utilize eye diagram simulation results obtained from the previous step to train the models. Lastly, we integrate the ML/DL models into the InFO router. To evaluate the SI improvement, we apply our new InFO routing flow on several HBM3 testcases, and observe SI improvement in worst eye height ranging from 7.69% to 11.27% and in average eye height ranging from 8.52% to 9.54%.
UR - http://www.scopus.com/inward/record.url?scp=85205672425&partnerID=8YFLogxK
U2 - 10.1109/NewCAS58973.2024.10666339
DO - 10.1109/NewCAS58973.2024.10666339
M3 - Conference contribution
AN - SCOPUS:85205672425
T3 - 2024 22nd IEEE Interregional NEWCAS Conference, NEWCAS 2024
SP - 343
EP - 347
BT - 2024 22nd IEEE Interregional NEWCAS Conference, NEWCAS 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd IEEE Interregional NEWCAS Conference, NEWCAS 2024
Y2 - 16 June 2024 through 19 June 2024
ER -