ML-based Thermal Sensor Calibration by Bivariate Gaussian Mixture Model Estimation

Wei Chien Kuo, Li Wei Liu, Yen Chin Liao, Hsie Chia Chang

研究成果: Conference contribution同行評審

摘要

This paper presents a machine-learning-based post signal processing to calibrate thermal sensors. The proposed calibration scheme is shown to be immune to the interference from the environment and fulfills the high-resolution requirements of human body temperature measurements. The sensing module comprises two resistive sensing circuits, one is for sensing the external temperature, and the other is for sensing the internal die temperature. By using these two thermal outputs, we trained two-dimensional multivariate Gaussian models for several temperature intervals. Higher accuracy can be obtained via the probability-based estimation. The simulation results show high accuracy even in a noisy environment. The proposed algorithm is implemented and fabricated in UMC 0.18m CMOS-MEMS technology. The sensor chip is tested by an embedded system (ARM V2M-MPS2). The measurement results show that the proposed method can effectively improve the accuracy from 1 degree Celsius to 0.1 degree Celsius.

原文English
主出版物標題Proceedings - 32nd IEEE International System on Chip Conference, SOCC 2019
編輯Danella Zhao, Arindam Basu, Magdy Bayoumi, Gwee Bah Hwee, Ge Tong, Ramalingam Sridhar
發行者IEEE Computer Society
頁面113-117
頁數5
ISBN(電子)9781728134826
DOIs
出版狀態Published - 9月 2019
事件32nd IEEE International System on Chip Conference, SOCC 2019 - Singapore, Singapore
持續時間: 3 9月 20196 9月 2019

出版系列

名字International System on Chip Conference
2019-September
ISSN(列印)2164-1676
ISSN(電子)2164-1706

Conference

Conference32nd IEEE International System on Chip Conference, SOCC 2019
國家/地區Singapore
城市Singapore
期間3/09/196/09/19

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