TY - GEN
T1 - Microstructure analysis and tensile strength of low temperature Cu bonds using highly-<111> Cu
AU - Ong, Jia Juen
AU - Shie, Kai Cheng
AU - Chen, Chih
N1 - Publisher Copyright:
© 2021 IEEE
PY - 2021/10/5
Y1 - 2021/10/5
N2 - This investigation shows bonding strength improvement by adjusting the microstructures in the Cu joints. The Cu pad used in this investigation is nanotwinned Cu pad with surface ratio more than 95% <111> preferred oriented. Result showed that bonding strength can be obtained in low temperature and pressure applied and short time during bonding process. Once the bonding time or pressure increases, recrystallization and grain growth triggered. By adjusting bonding time or bonding temperature, the microstructure in Cu pad can be controlled thus the bonding strength can be improved by adjusting microstructures in the Cu pads.
AB - This investigation shows bonding strength improvement by adjusting the microstructures in the Cu joints. The Cu pad used in this investigation is nanotwinned Cu pad with surface ratio more than 95% <111> preferred oriented. Result showed that bonding strength can be obtained in low temperature and pressure applied and short time during bonding process. Once the bonding time or pressure increases, recrystallization and grain growth triggered. By adjusting bonding time or bonding temperature, the microstructure in Cu pad can be controlled thus the bonding strength can be improved by adjusting microstructures in the Cu pads.
UR - http://www.scopus.com/inward/record.url?scp=85120432959&partnerID=8YFLogxK
U2 - 10.1109/LTB-3D53950.2021.9598367
DO - 10.1109/LTB-3D53950.2021.9598367
M3 - Conference contribution
AN - SCOPUS:85120432959
T3 - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
SP - 25
BT - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Y2 - 5 October 2021 through 11 October 2021
ER -