Microstructural Characterization of Multilayer Metal Stack on InGaAs/InP Contact

Engineering & Materials Science

• Annealing 68%
• Atomic force microscopy 43%
• Diffraction 37%
• Electric lines 28%
• Melting 32%
• Metals 66%
• Multilayers 100%
• Rapid thermal annealing 52%
• Surface chemistry 45%
• Surface roughness 57%
• Temperature 41%
• Transmission electron microscopy 35%
• X rays 31%

Chemical Compounds

• Annealing 40%
• Atomic Force Microscopy 20%
• Liquid Film 12%
• Melting 22%
• Metal 46%
• Multilayer 91%
• Parasitic 31%
• Rapid Thermal Annealing 38%
• Resistance 65%
• Surface Chemistry 23%
• Transmission Electron Microscopy 16%

Physics & Astronomy

• annealing 46%
• atomic force microscopy 19%
• characterization 57%
• conduction 17%
• electric contacts 22%
• electrical resistivity 16%
• melting 20%
• metal films 26%
• metals 52%
• roughness 42%
• temperature 22%
• transmission electron microscopy 16%
• transmission lines 24%
• x ray diffraction 22%