Micro-moiré methods - Optical and scanning techniques

A. Asundi*, H. Xie, C. Li, Gin Boay Chai Gin Boay, Kim Eng Oh Kim Eng

*此作品的通信作者

研究成果: Conference article同行評審

5 引文 斯高帕斯(Scopus)

摘要

Moiré method is an effective way to measure full field deformation. In this paper, the atomic force microscope scanning moiré method and micro-moiré interferometry method are proposed to determine the deformation in micro-area. The measurement principle and techniques are discussed. The two methods are applied to measure thermal deformation in a BGA (ball grid array) electronic package component. The shear strain γxy at the solder site is determined. The experimental results including the adaptability of these two methods are compared and analyzed. The results show that AFM scanning moiré and micro-moiré interferometry methods are effective ways to measure the deformation in micro-area with high sensitivity.

原文English
頁(從 - 到)54-57
頁數4
期刊Proceedings of SPIE - The International Society for Optical Engineering
4416
DOIs
出版狀態Published - 2001
事件Optical Engineering for Sensing and Nanotechnology (ICOSN 2001) - Yokohama, Japan
持續時間: 6 6月 20018 6月 2001

指紋

深入研究「Micro-moiré methods - Optical and scanning techniques」主題。共同形成了獨特的指紋。

引用此