Moiré method is an effective way to measure full field deformation. In this paper, the atomic force microscope scanning moiré method and micro-moiré interferometry method are proposed to determine the deformation in micro-area. The measurement principle and techniques are discussed. The two methods are applied to measure thermal deformation in a BGA (ball grid array) electronic package component. The shear strain γxy at the solder site is determined. The experimental results including the adaptability of these two methods are compared and analyzed. The results show that AFM scanning moiré and micro-moiré interferometry methods are effective ways to measure the deformation in micro-area with high sensitivity.
|頁（從 - 到）||54-57|
|期刊||Proceedings of SPIE - The International Society for Optical Engineering|
|出版狀態||Published - 2001|
|事件||Optical Engineering for Sensing and Nanotechnology (ICOSN 2001) - Yokohama, Japan|
持續時間: 6 6月 2001 → 8 6月 2001