Micro-masking removal of TSV and cavity during ICP etching using parameter control in 3D and MEMS integrations

Yu Chen Hu, Cheng Hao Chiang, Kuo Hua Chen, Chi Tsung Chiu, Ching Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho Ming Tong, Kuan-Neng Chen*

*此作品的通信作者

研究成果: Conference contribution同行評審

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Engineering & Materials Science